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High Thermal Conductivity AlN Films for Advanced 3D Chiplets. - T. Takagi; T. Ninomiya; M. Niwa; S. Obara; T. Momose; Y. Shimogaki; M. Nomura; H. Fujioka; M. Mori; T. Kuroda (VLSI Technology and Circuits, 2024)

Integration and Characterization of High Thermal Conductivity Materials for Heat Dissipation in Stacked Devices. - W.-Y. Woon; J.-H. Jhang; K.-K. Hu; C.-C. Shih; J.-F. Hsu; J.-P. Lin; Y. Wu; Anna Kasperovich; Mohamadali Malakoutian; Rohith Soman; J. Kim; H.-K. Wei; et al. (VLSI Technology and Circuits, 2024)