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A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration. - Weng Hong Teh; Raymond Caramto; Jamal Qureshi; Sitaram Arkalgud; M. O'Brien; T. Gilday; Kou Maekawa; T. Saito; Kouichi Maruyama; Thenappan Chidambaram; Wei Wang 003; David Marx; et al. (3DIC, 2009)