Evaluation of analytical models for thermal analysis and design of electronic packages. - Saeed Moghaddam; M. Rada; Amir Shooshtari; M. Ohadi; Y. Joshi (Microelectron. J., 2003)

Direct Liquid Cooling of High Flux Micro and Nano Electronic Components. - Avram Bar-Cohen; Mehmet Arik; M. Ohadi (Proc. IEEE, 2006)