Influence of solder bump arrangements on molded IC encapsulation. - C. Y. Khor; Mohd Zulkifly Abdullah; Chun-Sean Lau; W. C. Leong; M. S. Abdul Aziz (Microelectron. Reliab., 2014)

Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology. - M. S. Abdul Aziz; Mohd Zulkifly Abdullah; C. Y. Khor; I. A. Azid (Simul. Model. Pract. Theory, 2015)

Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. - Fei Chong Ng; Aizat Abas; Muhammad Hafifi Hafiz Ishak; Mohd Zulkifly Abdullah; M. S. Abdul Aziz (Microelectron. Reliab., 2016)

Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board. - Chong Hooi Lim; Mohd Zulkifly Abdullah; Ishak Abdul Azid; M. S. Abdul Aziz (Microelectron. Reliab., 2017)