Joint use of DEA and constrained canonical correlation analysis for efficiency valuations involving categorical variables. - K. S. Park; K. W. Lee; M. S. Park; D. Kim (J. Oper. Res. Soc., 2009)

Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packaging. - M. S. Park; S. L. Gibbons; Raymundo Arróyave (Microelectron. Reliab., 2014)