Secure Interposer-Based Heterogeneous Integration. - M. Shafkat M. Khan; Chengjie Xi; Aslam A. Khan; M. Tanjidur Rahman; Mark Tehranipoor; Navid Asadizanjani (IEEE Des. Test, 2022)

US Microelectronics Packaging Ecosystem: Challenges and Opportunities. - Rouhan Noor; Himanandhan Reddy Kottur; Patrick J. Craig; Liton Kumar Biswas; M. Shafkat M. Khan; Nitin Varshney; Hamed Dalir; Elif Akçali; Bahar Ghane Motlagh; Charles Woychik; Yong-Kyu Yoon; Navid Asadizanjani (CoRR, 2023)

From Design to Inspection: Can Inspection-aware Design Enhance Reliability in Advanced Packaging? - Katayoon Yahyaei; M. Shafkat M. Khan; Navid Asadizanjani (VTS, 2025)

Inherent Hardware Identifiers: Advancing IC Traceability and Provenance in the Multi-Die Era. - M. Shafkat M. Khan; Chengjie Xi; Nitin Varshney; Je-Hyeong Bahk; Navid Asadizanjani (J. Electron. Test., 2025)

Toward Standardized Vulnerability Assessment of Advanced Packaging Against Probing Attacks. - M. Shafkat M. Khan; Liton Kumar Biswas; Himanandhan Reddy Kottur; Rouhan Noor; Nitin Varshney; Nelson Hastings; Navid Asadizanjani (IEEE Des. Test, 2025)