Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. - Tobias Hoose; Muhammad Rodlin Billah; Matthias Blaicher; Pablo Marin; Philipp-Immanuel Dietrich; Andreas Hofmann; Ute Troppenz; Martin Möhrle; Nicole Lindenmann; M. Thiel; P. Simon; Jörg Hoffmann; et al. (OFC, 2016)