The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates. - N. Duan; J. Scheer; J. Bielen; M. van Kleef (Microelectron. Reliab., 2003)

Mechanical reliability challenges for MEMS packages: Capping. - Willem D. van Driel; Dao-Guo Yang; Cadmus A. Yuan; M. van Kleef; G. Q. (Kouchi) Zhang (Microelectron. Reliab., 2007)