Characterization method of thermomechanical parameters for microelectronic materials. - Oliver Perat; Jean-Marie Dorkel; Emmanuel Scheid; Pierre Temple-Boyer; Y. S. Chung; A. Peyre-Lavigne; M. Zecri; Patrick Tounsi (Microelectron. Reliab., 2002)

Determination of the ESD Failure Cause Through its Signature. - M. Zecri; P. Besse; Philippe Givelin; M. Nayrolles; Marise Bafleur; Nicolas Nolhier (Microelectron. Reliab., 2003)