Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (MWSCAS, 2020)

Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase Buck Converter. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (MWSCAS, 2020)

Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits. - Umamaheswara Rao Tida; Madhava Sarma Vemuri (SoCC, 2020)

An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits. - Dawei Li; Madhava Sarma Vemuri; Umamaheswara Rao Tida (CoRR, 2020)

Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (ICCD, 2023)

Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (ISQED, 2023)

Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic 3D Integration. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (MWSCAS, 2023)

FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (SOCC, 2023)

Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck Converter. - Maliha Elma; Madhava Sarma Vemuri; Umamaheswara Rao Tida (IEEE Access, 2023)

Compact 6T-SRAM Using Bottom-Gate Transistor in FD-SOI Process for Monolithic-3D Integration. - Madhava Sarma Vemuri; Tanvir Ahmed; Umamaheswara Rao Tida (ISVLSI, 2024)

Design Approaches and Consideration for a Reliable and Efficient Monolithic 3D Integration. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (ISVLSI, 2024)

Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC. - Madhava Sarma Vemuri; Umamaheswara Rao Tida (IEEE Access, 2024)