Effects of thermal cycling on aluminum metallization of power diodes. - Mads Brincker; Kristian Bonderup Pedersen; Peter Kjær Kristensen; Vladimir N. Popok (Microelectron. Reliab., 2015)

Mechanisms of metallization degradation in high power diodes. - Mads Brincker; Peter Kjær Kristensen; Kristian Bonderup Pedersen; Vladimir N. Popok (Microelectron. Reliab., 2016)

Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects. - Mads Brincker; S. Söhl; R. Eisele; Vladimir N. Popok (Microelectron. Reliab., 2017)

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates. - Mads Brincker; Peter Kjær Kristensen; S. Söhl; R. Eisele; Vladimir N. Popok (Microelectron. Reliab., 2018)