Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking. - Chetan Prasad; Sunny Chugh; Hannes Greve; I-chen Ho; Enamul Kabir; Cheyun Lin; Mahjabin Maksud; Steven R. Novak; Benjamin Orr; Keun Woo Park; Anthony Schmitz; Zhizheng Zhang 006; et al. (IRPS, 2020)

Reliability Characterization for 12 V Application Using the 22FFL FinFET Technology. - Chen-Yi Su; Mark Armstrong; Sunny Chugh; Mohammed El-tanani; Hannes Greve; Hai Li 008; Mahjabin Maksud; Benjamin Orr; Christopher Perini; James Palmer 002; Leif Paulson; Stephen Ramey; et al. (IRPS, 2020)