Through Silicon Vias as Enablers for 3D Systems - E. Jung; Andreas Ostmann; Peter Ramm; Jürgen Wolf; Michael Toepper; Maik Wiemer (CoRR, 2008)

Deposition of Parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices. - Franz Selbmann; Mario Baum; Maik Wiemer; Thomas Gessner (NEMS, 2016)

Investigation of Capacitive Micromachined Ultrasound Transducer for NDT and material inspection in metals and alloys. - Karman Selvam; Nooshin Saeidi; Yves Schwarzmann; Maik Wiemer; Harald Kuhn (I2MTC, 2025)