Wafer-level Variation Modeling for Multi-site RF IC Testing via Hierarchical Gaussian Process. - Michihiro Shintani; Riaz-ul-haque Mian; Michiko Inoue; Tomoki Nakamura; Masuo Kajiyama; Makoto Eiki (ITC, 2021)

Accurate Failure Rate Prediction Based on Gaussian Process Using WAT Data. - Makoto Eiki; Tomoki Nakamura; Masuo Kajiyama; Michiko Inoue; Michihiro Shintani (ITC, 2022)

Improving Efficiency and Robustness of Gaussian Process Based Outlier Detection via Ensemble Learning. - Makoto Eiki; Tomoki Nakamura; Masuo Kajiyama; Michiko Inoue; Takashi Sato 001; Michihiro Shintani (ITC, 2023)

Efficient Wafer-Level Spatial Variation Modeling for Multi-Site RF IC Testing. - Riaz-ul-haque Mian; Tomoki Nakamura; Masuo Kajiyama; Makoto Eiki; Michihiro Shintani (IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2024)

Wafer-Level Characteristic Variation Modeling Considering Systematic Discontinuous Effects. - Takuma Nagao; Tomoki Nakamura; Masuo Kajiyama; Makoto Eiki; Michiko Inoue; Michihiro Shintani (IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2024)