Design and implementation of an efficient fair off-line e-cash system based on elliptic curve discrete logarithm problem. - Manho Lee; Gookwhan Ahn; Jinho Kim; Jaegwan Park; Byoungcheon Lee; Kwangjo Kim; Hyuckjae Lee (J. Commun. Networks, 2002)

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. - Jaemin Lim; Manho Lee; Daniel H. Jung; Jonghoon J. Kim; Sumin Choi; Hyunsuk Lee; Joungho Kim (EMC Compo, 2015)

High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. - Manho Lee; Daniel H. Jung; Heegon Kim; Jonghyun Cho; Joungho Kim (IEEE Des. Test, 2016)