High-density capacitors for SiP and SoC applications based on three-dimensional integrated metal-isolator-metal structures. - Wenke Weinreich; Matthias Rudolph; Johannes Koch; Jan Paul; Konrad Seidel; Stefan Riedel; Jonas Sundqvist; Katja Steidel; Manuela Gutsch; Volkhard Beyer; Christoph Hohle (ICICDT, 2013)