Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. - Geert Van der Plas; Steven Thijs; Dimitri Linten; Guruprasad Katti; Paresh Limaye; Abdelkarim Mercha; Michele Stucchi; Herman Oprins; Bart Vandevelde; Nikolaos Minas; Miro Cupac; Morin Dehan; et al. (CICC, 2010)

Design issues and considerations for low-cost 3D TSV IC technology. - Geert Van der Plas; Paresh Limaye; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Domae Shinichi; Vladimir Cherman; et al. (ISSCC, 2010)

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. - Geert Van der Plas; Paresh Limaye; Igor Loi; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Vladimir Cherman; et al. (IEEE J. Solid State Circuits, 2011)