An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. - Léa Di Cioccio; Pierric Gueguen; Rachid Taibi; Thomas Signamarcheix; Laurent Bally; Laurent Vandroux; Marc Zussy; Sophie Verrun; Jérôme Dechamp; Patrick Leduc; Myriam Assous; David Bouchu; et al. (3DIC, 2009)

First integration of Cu TSV using die-to-wafer direct bonding and planarization. - Patrick Leduc; Myriam Assous; Léa Di Cioccio; Marc Zussy; Thomas Signamarcheix; Antonio Roman; Maxime Rousseau; Sophie Verrun; Laurent Bally; David Bouchu; Lionel Cadix; Alexis Farcy; et al. (3DIC, 2009)

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. - Emilie Bourjot; Paul Stewart; Christophe Dubarry; E. Lagoutte; E. Rolland; Nicolas Bresson; G. Romano; D. Scevola; Viorel Balan; Jérôme Dechamp; Marc Zussy; Gaëlle Mauguen; et al. (3DIC, 2019)