Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. - Willem D. van Driel; C. J. Liu; G. Q. Zhang; J. H. J. Janssen; Richard B. R. van Silfhout; Marcel A. J. van Gils; Leo J. Ernst (Microelectron. Reliab., 2004)

Characterization and Modelling of Moisture Driven Interface Failures. - Marcel A. J. van Gils; P. J. J. H. A. Habets; G. Q. Zhang; Willem D. van Driel; Piet J. G. Schreurs (Microelectron. Reliab., 2004)

Prediction of crack growth in IC passivation layers. - Y. T. He; Marcel A. J. van Gils; Willem D. van Driel; G. Q. Zhang; Richard B. R. van Silfhout; Leo J. Ernst (Microelectron. Reliab., 2004)

Prediction of Delamination Related IC & Packaging Reliability Problems. - W. D. van Driel; Marcel A. J. van Gils; Richard B. R. van Silfhout; G. Q. Zhang (Microelectron. Reliab., 2005)

Advanced structural similarity rules for the BGA package family. - W. D. van Driel; A. Mavinkurve; Marcel A. J. van Gils; G. Q. Zhang (Microelectron. Reliab., 2007)

Virtual qualification of moisture induced failures of advanced packages. - Marcel A. J. van Gils; W. D. van Driel; G. Q. Zhang; H. J. L. Bressers; Richard B. R. van Silfhout; X. J. Fan; J. H. J. Janssen (Microelectron. Reliab., 2007)

Analysis of Cu/low-k bond pad delamination by using a novel failure index. - Marcel A. J. van Gils; Olaf van der Sluis; G. Q. Zhang; J. H. J. Janssen; R. M. J. Voncken (Microelectron. Reliab., 2007)

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. - Olaf van der Sluis; R. A. B. Engelen; Richard B. R. van Silfhout; W. D. van Driel; Marcel A. J. van Gils (Microelectron. Reliab., 2007)

Temperature stability of a piezoresistive MEMS resonator including self-heating. - S. Bendida; J. J. Koning; J. J. M. Bontemps; J. T. M. van Beek; D. Wu; Marcel A. J. van Gils; S. Nath (Microelectron. Reliab., 2008)