Characterization and FE analysis on the shear test of electronic materials. - Marcel Gonzalez; Bart Vandevelde; R. Van Hoof; Eric Beyne (Microelectron. Reliab., 2004)

A novel concept for ultra-low capacitance via-last TSV. - Yann Civale; Marcel Gonzalez; Deniz Sabuncuoglu Tezcan; Youssef Travaly; Philippe Soussan; Eric Beyne (3DIC, 2010)

Analysis of microbump induced stress effects in 3D stacked IC technologies. - Andrej Ivankovic; Geert Van der Plas; V. Moroz; M. Choi; Vladimir Cherman; Abdelkarim Mercha; Paul Marchal; Marcel Gonzalez; Geert Eneman; Wenqi Zhang; Thibault Buisson; Mikael Detalle; et al. (3DIC, 2011)

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. - Bart Vandevelde; Andrej Ivankovic; B. Debecker; Melina Lofrano; Kris Vanstreels; Wei Guo; Vladimir Cherman; Marcel Gonzalez; Geert Van der Plas; Ingrid De Wolf; Eric Beyne; Zsolt Tokei (Microelectron. Reliab., 2014)

B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages. - Aidan Cowley; Andrej Ivankovic; C. S. Wong; N. S. Bennett; A. N. Danilewsky; Marcel Gonzalez; Vladimir Cherman; Bart Vandevelde; Ingrid De Wolf; Patrick J. McNally (Microelectron. Reliab., 2016)

Multi-pitch Estimation meets Microphone Mismatch: Applicability of Domain Adaptation. - Franca Bittner; Marcel Gonzalez; Maike L. Richter; Hanna M. Lukashevich; Jakob Abeßer (ISMIR, 2022)