Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. - Gweltaz Gaudin; Gregory Riou; Didier Landru; Catherine Tempesta; Ionut Radu; Mariam Sadaka; Kevin Winstel; Emily Kinser; Robert Hannon (3DIC, 2010)

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. - Ionut Radu; Didier Landru; Gweltaz Gaudin; Gregory Riou; Catherine Tempesta; Fabrice Letertre; Léa Di Cioccio; Pierric Gueguen; Thomas Signamarcheix; C. Euvrard; Jérôme Dechamp; Laurent Clavelier; et al. (3DIC, 2010)

Pre bonding metrology solutions for 3D integration. - Gregory Riou; Gweltaz Gaudin; Didier Landru; Catherine Tempesta; Ionut Radu; Mariam Sadaka; Kevin Winstel; Emily Kinser; Robert Hannon; Boris V. Kamenev; Michael Darwin; Robert Sachs (3DIC, 2010)

Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration. - Mariam Sadaka; Ionut Radu; Chrystelle Lagahe-Blanchard; Léa Di Cioccio (ICICDT, 2013)