Power-Efficient and Memory-Aware Approximate Hardware Design for HEVC FME Interpolator. - Wagner Penny; Mariana Ucker; Italo Machado; Luciano Agostini; Daniel Palomino 001; Marcelo Schiavon Porto; Bruno Zatt (ICECS, 2018)

Low-Power and High-Throughput Architecture for 3D-HEVC Depth Modeling Mode 4. - Mariana Ucker; Vladimir Afonso; Luan Audibert; Altamiro Amadeu Susin; Bruno Zatt; Marcelo Schiavon Porto; Luciano Volcan Agostini (SBCCI, 2018)

High-Throughput Hardware for 3D-HEVC Depth-Map Intra Prediction. - Mariana Ucker; Vladimir Afonso; Mário Saldanha; Luan Audibert; Ruhan A. Conceição; Altamiro Amadeu Susin; Marcelo Schiavon Porto; Bruno Zatt; Luciano Agostini (IEEE Des. Test, 2020)