Study of internal behavior in a vertical DMOS transistor under short high current stress by an interferometric mapping method. - M. Blaho; Dionyz Pogany; Erich Gornik; Marie Denison; Gerhard Groos; Matthias Stecher (Microelectron. Reliab., 2003)

Multiple-time-instant 2D thermal mapping during a single ESD event. - Viktor Dubec; Sergey Bychikhin; M. Blaho; Michael Heer; Dionyz Pogany; Marie Denison; Nils Jensen; Matthias Stecher; Gerhard Groos; Erich Gornik (Microelectron. Reliab., 2004)

Automated setup for thermal imaging and electrical degradation study of power DMOS devices. - Michael Heer; Viktor Dubec; M. Blaho; Sergey Bychikhin; Dionyz Pogany; Erich Gornik; Marie Denison; Matthias Stecher; Gerhard Groos (Microelectron. Reliab., 2005)

Modeling and characterization of hot-carrier stress degradation in power MOSFETs (invited). - Susanna Reggiani; Elena Gnani; Antonio Gnudi; Giorgio Baccarani; Stefano Poli; Rick Wise; Ming-Yeh Chuang; Weidong Tian; Marie Denison (ESSDERC, 2013)

TCAD modeling of encapsulation layer in high-voltage, high-temperature operation regime. - Ilaria Imperiale; Susanna Reggiani; Elena Gnani; Antonio Gnudi; Giorgio Baccarani; Luu Nguyen; Marie Denison (ESSDERC, 2014)

Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization. - Andres Garcia; Nathan Warner; Nandika Anne D'Souza; Enis Tuncer; Luu Nguyen; Marie Denison; Jeffrey T. Fong (IEEE Trans. Ind. Electron., 2016)