Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier. - Mathieu Vanden Bulcke; Kris Baert; Eric Beyne; Mario Gonzalez; Christophe Winters; Tomas Webers (EMBC, 2006)

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. - Bart Vandevelde; Mario Gonzalez; Paresh Limaye; Petar Ratchev; Eric Beyne (Microelectron. Reliab., 2007)

Design of metal interconnects for stretchable electronic circuits. - Mario Gonzalez; Fabrice Axisa; Mathieu Vanden Bulcke; Dominique Brosteaux; Bart Vandevelde; Jan Vanfleteren (Microelectron. Reliab., 2008)

Design and implementation of flexible and stretchable systems. - Mario Gonzalez; Bart Vandevelde; Wim Christiaens; Yung-Yu Hsu; François Iker; Frederick Bossuyt; Jan Vanfleteren; Olaf van der Sluis; P. H. M. Timmermans (Microelectron. Reliab., 2011)

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. - Wei Guo; Geert Van der Plas; Andrej Ivankovic; Geert Eneman; Vladimir Cherman; Bart De Wachter; Abdelkarim Mercha; Mario Gonzalez; Yann Civale; Augusto Redolfi; Thibault Buisson; A. Jourdan; et al. (ICICDT, 2012)

Metallization scheme optimization of plastic-encapsulated electronic power devices. - Jan Ackaert; Tony Colpaert; Aditi Malik; Mario Gonzalez (ICICDT, 2015)

Nonexistent harmonics generation phenomenon caused by the processing of DQ transformation in power quality applications. - Mario Gonzalez; Victor M. Cárdenas; Ricardo Alvarez (ICIT, 2015)

Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability. - Michal Jablonski; Riccardo Lucchini; Frederick Bossuyt; Thomas Vervust; Jan Vanfleteren; J. W. C. DeVries; Pasquale Vena; Mario Gonzalez (Microelectron. Reliab., 2015)

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. - Nabi Nabiollahi; Nele Moelans; Mario Gonzalez; Joke De Messemaeker; Christopher J. Wilson; Kristof Croes; Eric Beyne; Ingrid De Wolf (Microelectron. Reliab., 2015)

Managing Quality of Service in Wireless Body Area Networks using CoAP. - Ehsan Monsef; Mario Gonzalez; Won-Jae Yi; Jafar Saniie (EIT, 2016)

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. - Luka Kljucar; Mario Gonzalez; Ingrid De Wolf; Kristof Croes; Jürgen Bömmels; Zsolt Tökei (Microelectron. Reliab., 2016)

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. - Houman Zahedmanesh; Mario Gonzalez; Ivan Ciofi; Kristof Croes; Jürgen Bömmels; Zsolt Tökei (Microelectron. Reliab., 2016)

Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices. - Kristof J. P. Jacobs; T. Wang; Michele Stucchi; Mario Gonzalez; Kris Croes; Ingrid De Wolf; Eric Beyne (Microelectron. Reliab., 2017)

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. - Luka Kljucar; Mario Gonzalez; Kristof Croes; Ingrid De Wolf; Joke De Messemaeker; Gayle Murdoch; Philip Nolmans; Joeri De Vos; Jürgen Bömmels; Eric Beyne; Zsolt Tökei (Microelectron. Reliab., 2017)

Stress mitigation of 3D-stacking/packaging induced stresses. - Kristof Croes; Vladimir Cherman; Melina Lofrano; Houman Zahedmanesh; Luka Kljucar; Mario Gonzalez; Ingrid De Wolf; Zsolt Tökei; Eric Beyne (IRPS, 2018)

Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. - Melina Lofrano; Vladimir Cherman; Mario Gonzalez; Eric Beyne (Microelectron. Reliab., 2018)

Impact of Mechanical Stress on the Electrical Performance of 3D NAND. - Anastasiia Kruv; Antonio Arreghini; Mario Gonzalez; Devin Verreck; Geert Van den Bosch; Ingrid De Wolf; Arnaud Furnémont (IRPS, 2019)

On the impact of mechanical stress on gate oxide trapping. - Anastasiia Kruv; Ben Kaczer; Alexander Grill; Mario Gonzalez; Jacopo Franco; Dimitri Linten; Wolfgang Goes; Tibor Grasser; Ingrid De Wolf (IRPS, 2020)

Impact of mechanical strain on wakeup of HfO2 ferroelectric memory. - Anastasiia Kruv; Sean R. C. McMitchell; Sergiu Clima; Oguzhan O. Okudur; Nicolo Ronchi; Geert Van den Bosch; Mario Gonzalez; Ingrid De Wolf; Jan Van Houdt (IRPS, 2021)

Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress. - Kookjin Lee; Ben Kaczer; Anastasiia Kruv; Mario Gonzalez; Geert Eneman; Oguzhan O. Okudur; Alexander Grill; Jacopo Franco; Andrea Vici; Robin Degraeve; Ingrid De Wolf (IRPS, 2022)