Co-Design of ReRAM Passive Crossbar Arrays Integrated in 180 nm CMOS Technology. - Jury Sandrini; Marios Barlas; Maxime Thammasack; Tugba Demirci; Michele De Marchi; Davide Sacchetto; Pierre-Emmanuel Gaillardon; Giovanni De Micheli; Yusuf Leblebici (IEEE J. Emerg. Sel. Topics Circuits Syst., 2016)

Electrical Characterization of the Backside Interface on BSI Global Shutter Pixels with Tungsten-Shield Test Structures on CDTI Process. - Célestin Doyen; Stéphane Ricq; Pierre Magnan; Olivier Marcelot; Marios Barlas; Sébastien Place (Sensors, 2020)