High-density Evanescent Chip Coupling with Detachable Fiber Connector for Co-packaged Optics. - Lars Brusberg; Jorge A. Holguin-Lerma; Janderson R. Rodrigues; Betsy J. Johnson; Jason R. Grenier; Marissa Granados-Baez; Robin M. Force; Aramais R. Zakharian; Chad C. Terwilliger; Katerina Rousseva (OFC, 2025)