6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters. - Christophe Erdmann; Donnacha Lowney; Adrian Lynam; Aidan Keady; John McGrath; Edward Cullen; Daire Breathnach; Denis Keane; Patrick Lynch; Marites De La Torre; Ronnie De La Torre; Peng Lim; et al. (ISSCC, 2014)

A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters. - Christophe Erdmann; Donnacha Lowney; Adrian Lynam; Aidan Keady; John McGrath; Edward Cullen; Daire Breathnach; Denis Keane; Patrick Lynch; Marites De La Torre; Ronnie De La Torre; Peng Lim; et al. (IEEE J. Solid State Circuits, 2015)

16.3 A 330mW 14b 6.8GS/s dual-mode RF DAC in 16nm FinFET achieving -70.8dBc ACPR in a 20MHz channel at 5.2GHz. - Christophe Erdmann; Edward Cullen; Damien Brouard; Roberto Pelliconi; Bob Verbruggen; John McGrath; Diarmuid Collins; Marites De La Torre; Pierrick Gay; Patrick Lynch; Peng Lim; Anthony Collins; et al. (ISSCC, 2017)