Simulation methodology and flow integration for 3D IC stress management. - Mark Nakamoto; Riko Radojcic; Wei Zhao; Vinay K. Dasarapu; Aditya P. Karmarkar; Xiaopeng Xu (CICC, 2010)

Electrical Characterization for Intertier Connections and Timing Analysis for 3-D ICs. - Xiaoxia Wu; Wei Zhao; Mark Nakamoto; Chandra Nimmagadda; Durodami Lisk; Sam Gu; Riko Radojcic; Matt Nowak; Yuan Xie 001 (IEEE Trans. Very Large Scale Integr. Syst., 2012)