High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. - Rao R. Tummala; John U. Knickerbocker; Sarah H. Knickerbocker; L. Wynn Herron; Robert W. Nufer; Raj N. Master; Mark O. Neisser; Benedikt M. Kellner; Charles H. Perry; James N. Humenik; Thomas F. Redmond (IBM J. Res. Dev., 1992)

How Lithography and Metrology Are Enabling Yield in the Next Generation of Semiconductor Patterning. - Mark O. Neisser; Ndubuisi G. Orji; Harry J. Levinson; Umberto Celano; James R. Moyne; Supika Mashiro; Dan Wilcox; Slava Libman (Computer, 2024)