300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. - Anne Jourdain; Thibault Buisson; Alain Phommahaxay; Mark Privett; Dan Wallace; Sumant Sood; Peter Bisson; Eric Beyne; Youssef Travaly; Bart Swinnen (3DIC, 2010)