Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size. - Markus Thoben; X. Xie; D. Silber; Jürgen Wilde (Microelectron. Reliab., 2001)

Thermal impedance spectroscopy of power modules. - A. Hensler; D. Wingert; Christian Herold; Josef Lutz; Markus Thoben (Microelectron. Reliab., 2011)

Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions. - Bernhard Czerny; Martin Lederer; Bernhard Nagl; Alexander Trnka; Golta Khatibi; Markus Thoben (Microelectron. Reliab., 2012)

Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules. - Oliver Schilling; Marc Schäfer; Krzysztof Mainka; Markus Thoben; Frank Sauerland (Microelectron. Reliab., 2012)

Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects. - Bernhard Czerny; I. Paul; Golta Khatibi; Markus Thoben (Microelectron. Reliab., 2013)

Lifetime modeling and simulation of power modules for hybrid electrical/electrical vehicles. - Markus Thoben; F. Sauerland; K. Mainka; S. Edenharter; L. Beaurenaut (Microelectron. Reliab., 2014)

Der Forschungsschwerpunkt Cloud-basierte Energienetze. - Leon Otis Speith; Christoph Hericks; Seyed Saeed Mirsafian; Martin Kiel; Torsten Füg; Vinod Rajamani; Yves Rosefort; Markus Thoben (HMD Prax. Wirtsch., 2024)