Novel Bonding technologies for wafer-level transparent packaging of MOEMS - Herwig Kirchberger; Paul Lindner; Markus Wimplinger (CoRR, 2008)

Advanced wafer bonding solutions for TSV integration with thin wafers. - Bioh Kim; Thorsten Matthias; Markus Wimplinger; Paul Lindner (3DIC, 2009)

Recent progress in thin wafer processing. - Thomas Uhrmann; Thorsten Matthias; Markus Wimplinger; Jurgen Burggraf; Daniel Burgstaller; Harald Wiesbauer; Paul Lindner (3DIC, 2013)

Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. - Joeri De Vos; Lan Peng; Alain Phommahaxay; Joost Van Ongeval; Andy Miller; Eric Beyne; Florian Kurz; Thomas Wagenleiter; Markus Wimplinger; Thomas Uhrmann (3DIC, 2016)

EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration. - S. Ghosh; A. Kruv; Quentin Smets; Tom Schram; D. J. Leech; T. Ding; V. Turkani; Benjamin Groven; A. Dangel; G. Probst; Thomas Uhrmann; Markus Wimplinger; et al. (VLSI Technology and Circuits, 2024)