Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. - Fumihiro Inoue; Harold Philipsen; Marleen H. van der Veen; Kevin Vandersmissen; Stefaan Van Huylenbroeck; Herbert Struyf; Tetsu Tanaka (3DIC, 2014)

Doped GeSe materials for selector applications. - Naga Sruti Avasarala; Bogdan Govoreanu; Karl Opsomer; Wouter Devulder; Sergiu Clima; Christophe Detavernier; Marleen van der Veen; Jan Van Houdt; Marc Henys; Ludovic Goux; Gouri Sankar Kar (ESSDERC, 2017)

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. - Alicja Lesniewska; Philippe J. Roussel; Davide Tierno; Victor Vega-Gonzalez; Marleen H. van der Veen; Patrick Verdonck; Nicolas Jourdan 002; Christopher J. Wilson; Zsolt Tökei; Kris Croes (IRPS, 2020)

Metal reliability mechanisms in Ruthenium interconnects. - Olalla Varela Pedreira; Michele Stucchi; Anshul Gupta; Victor Vega-Gonzalez; Marleen van der Veen; Stephane Lariviere; Christopher J. Wilson; Zsolt Tökei; Kristof Croes (IRPS, 2020)

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. - Alicja Lesniewska; Olalla Varela Pedreira; Melina Lofrano; Gayle Murdoch; Marleen H. van der Veen; Anish Dangol; Naoto Horiguchi; Zsolt Tökei; Kris Croes (IRPS, 2021)

Assessment of critical Co electromigration parameters. - O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; Philippe J. Roussel; Marleen H. van der Veen; Veerle Simons; Emmanuel Chery; Ivan Ciofi; Kris Croes (IRPS, 2022)

Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND. - Davide Tierno; Antonio Arreghini; Alicja Lesniewska; Y. Jeong; Marleen H. van der Veen; J. Stiers; N. Bazzazian; Ivan Ciofi; Geert Van den Bosch; Maarten Rosmeulen (IRPS, 2024)