The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics. - Marta Kuczynska; Natalja Schafet; Ulrich Becker; B. Métais; Alexander Kabakchiev; P. Buhl; Stefan Weihe (Microelectron. Reliab., 2017)

Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load. - Marta Kuczynska; Natalja Schafet; Ulrich Becker; René Metasch; Mike Roellig; Alexander Kabakchiev; Stefan Weihe (Microelectron. Reliab., 2018)