Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heating. - Norbert Lorenz; Martin D. Smith; Duncan P. Hand (Microelectron. Reliab., 2011)

Workshop: Error correction, noise filtering, and phylogenetic analysis of HIV sequences using the 454 platform. - Konrad Scheffler; N. Lance Hepler; Martin D. Smith; Wayne Delport; Art F. Y. Poon; Douglas D. Richman; Sergei L. Kosakovsky Pond (ICCABS, 2012)

Progress in coupling models of human and coastal landscape change. - A. Brad Murray; Sathya Gopalakrishnan; Dylan E. McNamara; Martin D. Smith (Comput. Geosci., 2013)