Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions. - Bernhard Czerny; Martin Lederer; Bernhard Nagl; Alexander Trnka; Golta Khatibi; Markus Thoben (Microelectron. Reliab., 2012)

Delamination of polyimide/Cu films under mixed mode loading. - Thomas Walter; Martin Lederer; Golta Khatibi (Microelectron. Reliab., 2016)

High cycle fatigue testing of thermosonic ball bonds. - Alice Lassnig; Martin Lederer; Golta Khatibi; Rainer Pelzer; W. Robl; Michael Nelhiebel (Microelectron. Reliab., 2017)

Reliability of Cu wire bonds in microelectronic packages. - Ali Mazloum-Nejadari; Golta Khatibi; Bernhard Czerny; Martin Lederer; Johann Nicolics; L. Weiss (Microelectron. Reliab., 2017)

Effect of aging on mechanical properties of high temperature Pb-rich solder joints. - Golta Khatibi; A. Betzwar Kotas; Martin Lederer (Microelectron. Reliab., 2018)

FCAS Ethical AI Demonstrator. - Florian Osswald; Roman Bartolosch; Torsten Fiolka; Engelbert Hartmann; Bernhard Krach; Jan Feil; Martin Lederer (xAI (Late-breaking Work, Demos, Doctoral Consortium), 2023)