Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. - Pearl A. Agyakwa; Martin R. Corfield; Li Yang; Jianfeng Li 002; V. M. F. Marques; C. Mark Johnson (Microelectron. Reliab., 2011)

Repetitive high peak current pulsed discharge film-capacitor reliability testing. - H. Q. S. Dang; Martin R. Corfield; Alberto Castellazzi; C. Mark Johnson; Patrick Wheeler 001 (Microelectron. Reliab., 2012)

A thermal cycling reliability study of ultrasonically bonded copper wires. - Elaheh Arjmand; Pearl A. Agyakwa; Martin R. Corfield; Jianfeng Li 002; Bassem Mouawad; C. Mark Johnson (Microelectron. Reliab., 2016)