Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °C. - Stefan Schmitz; Martin Schneider-Ramelow; S. Schröder (Microelectron. Reliab., 2011)

The influence of liners with Ti, Ta or Ru finish on thin Cu films. - David Gross 004; Sabine Haag; Martin Schneider-Ramelow; Klaus-Dieter Lang (Microelectron. Reliab., 2014)

Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding. - Marian Sebastian Broll; Ute Geissler; Jan Höfer; Stefan Schmitz; Olaf Wittler; Martin Schneider-Ramelow; Klaus-Dieter Lang (Microelectron. Reliab., 2015)

The reliability of wire bonding using Ag and Al. - Martin Schneider-Ramelow; Christian Ehrhardt (Microelectron. Reliab., 2016)

The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications. - Ha-Duong Ngo; Piotr Mackowiak; Niels Grabbert; Thomas Weiland; Xiaodong Hu; Martin Schneider-Ramelow; Oswin Ehrmann; Klaus-Dieter Lang (ICST, 2017)

Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics. - Felix Wuest; S. Trampert; S. Janzen; Stefan Straube; Martin Schneider-Ramelow (Microelectron. Reliab., 2018)

Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method. - Manuel Baeuscher; Oliver Reinicke; Matthäus Henke; Piotr Mackowiak; Michael Schiffer; Martin Schneider-Ramelow; Klaus-Dieter Lang; Ha-Duong Ngo (DeSE, 2019)

Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor. - Piotr Mackowiak; Kolja Erbacher; Manuel Baeuscher; Michael Schiffer; Klaus-Dieter Lang; Martin Schneider-Ramelow; Ha-Duong Ngo (IEEE SENSORS, 2021)

The European Union's Energy Label for Smartphones: Does it Guide Consumers to Make Environmentally Sustainable Choices? - Karsten Schischke; Jana Rückschloss; Moritz-Caspar Schlegel; Jonathan Zöllinger; Nils F. Nissen; Martin Schneider-Ramelow (ICCE-Berlin, 2023)