Martin D. Verweij
Orcid: 0000-0002-7441-7218
According to our database1,
Martin D. Verweij
authored at least 26 papers
between 2015 and 2024.
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Bibliography
2024
A Pitch-Matched High-Frame-Rate Ultrasound Imaging ASIC for Catheter-Based 3-D Probes.
IEEE J. Solid State Circuits, February, 2024
2023
A 1.2-mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3-D Ultrasound Imaging.
IEEE J. Solid State Circuits, September, 2023
A Pitch-Matched Low-Noise Analog Front-End With Accurate Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.
IEEE J. Solid State Circuits, 2023
A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
Proceedings of the IEEE International Conference on Acoustics, 2023
2022
Sensors, 2022
Algorithm to Correct Measurement Offsets Introduced by Inactive Elements of Transducer Arrays in Ultrasonic Flow Metering.
Sensors, 2022
Measurement of Pipe and Liquid Parameters Using the Beam Steering Capabilities of Array-Based Clamp-On Ultrasonic Flow Meters.
Sensors, 2022
A Pitch-Matched Transceiver ASIC With Shared Hybrid Beamforming ADC for High-Frame-Rate 3-D Intracardiac Echocardiography.
IEEE J. Solid State Circuits, 2022
A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
A 1.2mW/channel 100µm-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
2021
IEEE Trans. Instrum. Meas., 2021
Design of an Ultrasound Transceiver ASIC with a Switching-Artifact Reduction Technique for 3D Carotid Artery Imaging.
Sensors, 2021
IEEE J. Solid State Circuits, 2021
Combining Ultrafast Ultrasound and High-Density EMG to Assess Local Electromechanical Muscle Dynamics: A Feasibility Study.
IEEE Access, 2021
A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.
Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021
2019
A 1.54mW/Element 150μm-Pitch-Matched Receiver ASIC with Element-Level SAR/Shared-Single-Slope Hybrid ADCs for Miniature 3D Ultrasound Probes.
Proceedings of the 2019 Symposium on VLSI Circuits, Kyoto, Japan, June 9-14, 2019, 2019
System identification of ankle joint dynamics based on plane-wave ultrasound muscle imaging.
Proceedings of the 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2019
2018
A Front-End ASIC With High-Voltage Transmit Switching and Receive Digitization for 3-D Forward-Looking Intravascular Ultrasound Imaging.
IEEE J. Solid State Circuits, 2018
A Reconfigurable Ultrasound Transceiver ASIC With 24×40 Elements for 3-D Carotid Artery Imaging.
IEEE J. Solid State Circuits, 2018
A Pitch-Matched Front-End ASIC With Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes.
IEEE J. Solid State Circuits, 2018
A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018
2017
A Front-End ASIC With Receive Sub-array Beamforming Integrated With a 32 × 32 PZT Matrix Transducer for 3-D Transesophageal Echocardiography.
IEEE J. Solid State Circuits, 2017
A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes.
Proceedings of the 43rd IEEE European Solid State Circuits Conference, 2017
A front-end ASIC with high-voltage transmit switching and receive digitization for forward-looking intravascular ultrasound.
Proceedings of the 2017 IEEE Custom Integrated Circuits Conference, 2017
2015
Proceedings of the 6th International Workshop on Advances in Sensors and Interfaces, 2015