Practical aspects of reliability analysis for IC designs. - Thomas Pompl; Christian Schlünder; Martina Hommel; Heiko Nielen; Jens Schneider (DAC, 2006)

Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems. - Oliver Aubel; Eberhard Bugiel; Dietmar Krüger; Wolfgang Hasse; Martina Hommel (Microelectron. Reliab., 2006)