Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation. - Marvin Chan; Cher Ming Tan; Kheng Chooi Lee; Chuan Seng Tan (Microelectron. Reliab., 2016)

Challenges and Opportunities in Last Mile Delivery: A Malaysian Case Study. - Satya Shah; Marvin Chan (ICAC, 2021)

An Approach to Cognitive Root Cause Analysis of Software Vulnerabilities. - Theo Hytopoulos; Marvin Chan; Keegan Roth; Rylan Wasson; Fuqun Huang (PROFES, 2024)