Residual stress evaluation in resin-molded IC chips using finite element analysis and piezoresistive gauges. - Masaaki Koganemaru; Toru Ikeda; Noriyuki Miyazaki (Microelectron. Reliab., 2008)

Study of the microstructure and the mechanical properties of Pb-2.5Ag-2Sn solder joint. - Kento Kariya; Atsushi Yumiba; Masaya Ukita; Toru Ikeda; Masaaki Koganemaru; Noriyuki Masago (IRPS, 2021)