Mechanical characterization of Sn-Ag-based lead-free solders. - Masazumi Amagai; Masako Watanabe; Masaki Omiya; Kikuo Kishimoto; Toshikazu Shibuya (Microelectron. Reliab., 2002)

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. - Masaki Omiya; Kozo Koiwa; Nobuyuki Shishido; Shoji Kamiya; Chuantong Chen; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo (Microelectron. Reliab., 2013)

Scenario for catastrophic failure in interconnect structures under chip package interaction. - Masaki Omiya; Shoji Kamiya; Nobuyuki Shishido; Kozo Koiwa; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo (IRPS, 2015)