Characterization of Trench MOS Gate Structures Utilizing Photon Emission Microscopy. - Masanori Usui; Takahide Sugiyama; Masayasu Ishiko; Jun Morimoto; Hirokazu Saitoh; Masaki Ajioka (Microelectron. Reliab., 2002)

Effects of uni-axial mechanical stress on IGBT characteristics. - Masanori Usui; Masayasu Ishiko; Koji Hotta; Satoshi Kuwano; Masato Hashimoto (Microelectron. Reliab., 2005)

Design concept for wire-bonding reliability improvement by optimizing position in power devices. - Masayasu Ishiko; Masanori Usui; Takashi Ohuchi; Mikio Shirai (Microelectron. J., 2006)

Warpage analysis of layered structures connected by direct brazing. - Takashi Asada; Yuji Yagi; Masanori Usui; T. Suzuki; Nobutada Ohno (Microelectron. Reliab., 2011)

Thermal cycle reliability of Cu-nanoparticle joint. - Toshitaka Ishizaki; Masanori Usui; Y. Yamada (Microelectron. Reliab., 2015)

Thermal simulation of joints with high thermal conductivities for power electronic devices. - Toshitaka Ishizaki; Masashi Yanase; A. Kuno; T. Satoh; Masanori Usui; F. Osawa; Yasushi Yamada (Microelectron. Reliab., 2015)

Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. - Toshitaka Ishizaki; Daiki Miura; Atsuki Kuno; Ryota Nagao; Syoho Aoki; Yuta Ohshima; Takuma Kino; Masanori Usui; Yasushi Yamada (Microelectron. Reliab., 2016)

Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography. - Masanori Usui; Hidehiko Kimura; Toshikazu Satoh; Takashi Asada; Satoshi Yamaguchi; Masashi Kato (Microelectron. Reliab., 2016)

Young's modulus of a sintered Cu joint and its influence on thermal stress. - Toshitaka Ishizaki; D. Miura; A. Kuno; K. Hasegawa; Masanori Usui; Y. Yamada (Microelectron. Reliab., 2017)

Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding. - Masanori Usui; Toshikazu Satoh; Hidehiko Kimura; S. Tajima; Y. Hayashi; Daigo Setoyama; Masashi Kato (Microelectron. Reliab., 2017)