Thermal characterizations of Cu nanoparticle joints for power semiconductor devices. - Toshitaka Ishizaki; T. Satoh; A. Kuno; A. Tane; Masashi Yanase; F. Osawa; Yasushi Yamada (Microelectron. Reliab., 2013)

Reliability of Cu nanoparticle joint for high temperature power electronics. - Toshitaka Ishizaki; A. Kuno; A. Tane; Masashi Yanase; F. Osawa; T. Satoh; Yasushi Yamada (Microelectron. Reliab., 2014)

Thermal simulation of joints with high thermal conductivities for power electronic devices. - Toshitaka Ishizaki; Masashi Yanase; A. Kuno; T. Satoh; Masanori Usui; F. Osawa; Yasushi Yamada (Microelectron. Reliab., 2015)

Novel heatsink for power semiconductor module using high thermal conductivity graphite. - Yasushi Yamada; Masashi Yanase; Daiki Miura; Katsuhiro Chikuba (Microelectron. Reliab., 2016)