Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. - Takafumi Fukushima; Shinichi Sakuyama; Masatomo Takahashi; Hiroyuki Hashimoto; Jichoel Bea; Theodorus Marcello; Hisashi Kino; Tetsu Tanaka; Mitsumasa Koyanagi; Mariappan Murugesan (3DIC, 2021)