Mechanical reliability in electronic packaging. - Masazumi Amagai (Microelectron. Reliab., 2002)

Mechanical characterization of Sn-Ag-based lead-free solders. - Masazumi Amagai; Masako Watanabe; Masaki Omiya; Kikuo Kishimoto; Toshikazu Shibuya (Microelectron. Reliab., 2002)

Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder. - YoungBae Kim; Hiroshi Noguchi; Masazumi Amagai (Microelectron. Reliab., 2006)

A study of nanoparticles in Sn-Ag based lead free solders. - Masazumi Amagai (Microelectron. Reliab., 2008)