Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology. - Yukai Chen; Massimiliano Di Todaro; Bjorn Vermeersch; Herman Oprins; Daniele Jahier Pagliari; Julien Ryckaert; Dwaipayan Biswas; James Myers (CoRR, 2025)