Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance. - Armen Kteyan; Jun-Ho Choy; Valeriy Sukharev; Massimo Bertoletti; Carmelo Maiorca; Rossana Zadra; Massimo Inzaghi; Gabriele Gattere; Giancarlo Zinco; Paolo Valente; Roberto Bardelli; Alessandro Valerio; et al. (ISPD, 2022)