NDI of delamination in IC packages using millimeter-waves. - Yang Ju; Masumi Saka; Hiroyuki Abé (IEEE Trans. Instrum. Meas., 2001)

Influence of local thermal dissipation on electromigration in an Al thin-film line. - Yuan Li 063; Hsin-Tzu Lee; Masumi Saka (Microelectron. Reliab., 2016)